Topic: Short-Course on 3-D Integrated Systems

Speaker: Vasilis F. Pavlidis, The University of Manchester

Time: 14:00-15:30, November 5th - 9th

Venue: Room 425, IRC

Course Description:

Three-dimensional (3-D) or vertical integration is a promising system integration paradigm that can extend the microelectronics evolution for several more years. 3-D integrated systems can alleviate the challenge of continuous physical scaling, offering performance improvements equivalent to a technology node. More importantly, it can satisfy the growing need for computational and technological heterogeneity while simultaneously supporting multi-functional systems.

This course offers a succinct yet well-rounded introduction to 3-D integration and delves into issues crucial to the development of 3-D integrated systems. The origins of 3-D integration, the different integration approaches, and fabrication processes are discussed on Day 1. The audience is also introduced to the terminology relating to this field. The important issue of synchronization is analysed on Day 2. Thermal issues have been considered a challenge since the inception of 3-D integration. Thus, Day 3 is dedicated to this issue where tools and methods to explore and manage the thermal behaviour of 3-D systems are, respectively, presented. The emerging approach of monolithic 3-D circuits is emphasized on Day 4. The alternative and potent option of contactless 3-D circuits is considered on the last day of the course. The course material is suitable for senior undergraduate and post-graduate students with interests in the area of integrated circuits and systems.

Short Biography:

Vasilis F. Pavlidis is an Associate Professor in the School of Computer Science at the University of Manchester, UK. He holds an MSc and PhD degree from the University of Rochester, Rochester, NY, obtained in 2003 and 2008, respectively, all in Electrical and Computer Engineering. From 2008 to 2012, he was a post-doc at the Integrated Systems Laboratory of EPFL, Switzerland. He has 10+ years of research experience in the area of 3-D integration. He is the leading author of the book Three-Dimensional Integrated Circuit Design, (1st and 2nd Editions) and contributor to the software tool, Manchester Thermal Analyzer.

Course Schedule

School of Electronic and Information Engineering