Academic Journals

  • Journal of Aerospace Power

    The Journal of Aerospace Power is a core academic journal in China, jointly sponsored by the China Aeronautical Industry Corporation, the Chinese Society of Aeronautics and Astronautics, and Beihang University. First published in July 1986 as a quarterly, it is now a monthly publication distributed both domestically and internationally. Committed to an editorial principle of innovation, practicality, and scientific rigor, the journal primarily publishes academic papers, research reports, and comprehensive reviews. Its scope covers aerospace engine theory and design, aerothermodynamics, turbomachinery, combustion science, heat and mass transfer, strength and vibration, automatic control, mechanical transmission, experimental techniques, and thermal power.

    Indexed in the Following Databases

    1. Engineering Index (EI, U.S.A.)

    2. International Aerospace Abstracts, Aerospace Database (IAA, U.S.A.)

    3. AJ (Р.Ж., Rus.)

    4. Cambridge Science Abstracts (CSA, U.S.A.)

    5. Chinese Science Citation Database (CSCD, CHN)

    6. National Knowledge Infrastructure (CNKI, CHN)

    Contact for Submissions:

    E-mail: JAP@buaa.edu.cn

    Tel: +86-10-61716749

    Link:

    http://www.jasp.com.cn
  • Electromagnetic Science

    Electromagnetic Science is an international academic journal covering cutting-edge advancements in electromagnetics, linking theoretical innovations and technological breakthroughs.

    The journal aims to provide a platform for publishing the most advanced original and innovative research results in any field related to electromagnetics and photonics. As a prestigious peer-reviewed publication, it emphasizes both breadth and impact, focusing on current trends and emerging challenges in the global science and technology landscape of these fields. By integrating theoretical advances with practical applications, the journal provides scientists and engineers with a vital forum for discussing and exchanging academic insights and promotes a global ecology in the society of electromagnetics and photonics.

    The technical scope of Electromagnetic Science covers the latest advanced research in electromagnetic fundamental theories, photonic theories and technologies, electromagnetic/photonic enabling technologies and engineering developments, frontiers of interdisciplinary electromagnetics/photonic as well as applications. The typical fields of interests include, but are not limited to: the fundamental electromagnetic theory, photonic theory and technologies, artificial intelligence-aided techniques, antenna theory and techniques, bio-electromagnetics, computational electromagnetics, electromagnetic information, electromagnetic compatibility, metamaterials and metasurface, magnetic materials and technologies, microwave theory and techniques, plasmonics, quantum electromagnetics, scattering, imaging and remote sensing, IoT and distributive electronics, as well as interdisciplinary fields related to electromagnetics and photonics.

    Indexed in the Following Databases:

    1. EI Compendex

    2. Scopus

    3. Directory of Open Access Journal (DOAJ)

    Contact for Submissions:

    E-mail: office@emscience.org

    Tel: +86-10-68600728

    Link:

    http://mc03.manuscriptcentral.com/emscience
  • Chain

    Chain is a scholarly peer-reviewed, open-access international journal sponsored by The Nonferrous Metals Society of China and Beihang University, published by Youke Publishing, and hosted on IEEE Xplore. Its primary mission is to showcase significant advancements in comprehensive muti-dimensional transportation, encompassing waterways, railways, roadways, aviation and space, and comprehensive transportation.

    The journal welcomes submissions of full-length articles, short communications, review articles, perspectives, highlights, invited interviews, news and views, etc., featuring cutting-edge research, spanning foundations, methodologies and applications across fields such as transportation science & technology, computer science, engineering, electrical & electronic engineering, vehicle engineering & mobility, energy & fuels, materials science, and advanced manufacturing.

     

    Contact for Submissions:

    E-mail: chain-editor@youkepub.com

    Tel: +86-10-82241917

    Link:

    https://publish.cnki.net/chain
  • Virtual Reality & Intelligent Hardware

    Virtual Reality & Intelligent Hardware (VRIH) is an academic journal supervised by the Chinese Academy of Sciences and co-sponsored by China Science Publishing & Media Ltd. and Beihang University. It is ranked in the Q1 category of the Computer Graphics and Computer-Aided Design field in Scopus, with a CiteScore of 6.4 for 2024.

    As an open-access journal, VRIH publishes high-quality research in virtual reality and intelligent hardware, providing an international platform for academia and industry. It releases bimonthly English issues and employs a rigorous single-blind peer-review process.

    The journal covers a broad scope, including:

    • 5G and VR/AR/MR

    • Artificial intelligence for VR/AR/MR

    • Audio interfaces, sound rendering, and auditory perception

    • Brain-computer interfaces

    • Computer graphics techniques

    • Computer vision techniques

    • Content creation, authoring, and management

    • Conversational and speech interfaces

    • Crowd simulation

    • Display technologies

    • Embodied agents, virtual humans, and (self-)avatars

    • Haptic and tactile interfaces, wearable haptics, passive haptics, and pseudo-haptics

    • Human augmentation

    • Human-computer interaction for VR/AR/MR

    • Human factors and ergonomics

    • Image analysis and video processing

    • Immersive analytics and visualization techniques

    • Input devices

    • Locomotion and navigation

    • Machine learning and deep learning

    • Mediated and diminished reality

    • Medical simulation and navigation

    • Modeling and simulation

    • Multi-user and distributed systems

    • Multimodal capture and reconstruction

    • Multimodal/cross-modal interaction and perception

    • Multisensory rendering, registration, and synchronization

    • Perception and cognition

    • Presence, body ownership, and agency

    • Scene description and management

    • Sensor fusion

    • Software architectures, toolkits, and engineering

    • Storytelling

    • Teleoperation and telepresence

    • Touch, tangible, and gesture interfaces

    • Tracking and sensing

    • Usage research, evaluation methods, and empirical studies

    • VR/AR/MR applications

    VRIH serves a global readership and welcomes submissions from researchers worldwide.

    Indexed in the Following Databases:

    1. Emerging Sources Citation Index (ESCI)

    2. EI Compendex

    3. Scopus

    4. Chinese Science Citation Database (CSCD)

    5. Directory of Open Access Journals (DOAJ)

    6. DBLP - Computer Science Bibliography

    7. INSPEC

    8. CCF graded directory of high-quality journals indexed

    Contact for Submissions:

    E-mail: vrih@vip.163.com

    Tel: +86-10-64010640

    Link:

    https://www.sciencedirect.com/journal/virtual-reality-and-intelligent-hardware
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