News & Events
In-Plane and Out-of-Plane Deformation of 2D Materials and 2D-Materials-Based Bioelectronics
Release time:June 14, 2019

Topic: In-Plane and Out-of-Plane Deformation of 2D Materials and 2D-Materials-Based Bioelectronics

Speaker: Prof. Nanshu Lu, The University of Texas at Austin

Time: 10:00 AM, June 17

Venue: C708, New Main Building


Two-dimensional (2D) materials have exhibited many unique functionalities and properties. Their atomic thinness and mechanical robustness make them promising candidates for next generation flexible, stretchable and bio-integrated electronics. Through combined experimental and theoretical investigation, this talk unveils the in-plane stretchability of 2D materials and their electrical contacts as well as their out-of-plane deformation through nano-bubbles and nano-tents. We will show that both in-plane and out-of-plane deformation are largely governed by the underlying substrate. In fact, out-of-plane deformation also induces in-plane strain and strain gradient. By examining experimentally measured profiles of a variety of nano-bubbles and nano-tents, we found all of them to collapse into a simple power law. Using the membrane limit of the Föppl–von Kármán equations, we can analytically solve the strain field in the nano-bubbles and nano-tents, which has been validated via Raman mapping. Moreover, by measuring the profiles of the nano-bubbles, nano-tents, and radial buckles surrounding them, interface 2D materials-to-substrate interface properties such as adhesion and shear strength can also be extracted.

Biography of the Speaker:

Dr. Nanshu Lu is currently Temple Foundation Endowed Associate Professor at the University of Texas at Austin. She received her Ph.D. from Harvard University and then Beckman Postdoctoral Fellowship at UIUC. Her research concerns the mechanics, materials, manufacture and human integration of soft electronics. She has published more than 80 journal articles with more than 10,000 citations. She has been named 35 innovators under 35 by MIT Technology Review (TR 35) and has received NSF CAREER Award and multiple DOD Young Investigator Awards. She is the Associate Editor of Soft Robotics.

School of Aeronautic Science and Engineering